Precision Microelectronics Services: From Thin Film to Full Assembly
Maximum packaging density and flexibility for your electronics: we realize your projects with high-precision photolithography, structured substrates, and innovative HiCoFlex® solutions – tailored and process-reliable.
Comprehensive Service Portfolio for Your Microelectronics Projects
We support you in the realization of complex electronic assemblies. Our focus lies on the technological implementation of your requirements through specialized manufacturing processes:
Structuring & Photolithography
We manufacture high-precision structures for your circuit carriers:
- Standard Fine-Pitch: Realization of structures down to 10/10 µm (Line/Space).
- Structured Substrates: Thin-film processing on square substrates in sizes of 4", 6", 12", and 24".
- MCM & Hybrids: Additive thin-film techniques for extremely high interconnection densities.
HiCoFlex® – Ultra-Thin Circuit Solutions
Take advantage of our service for the development and manufacture of HiCoFlex® circuits. These enable:
- Extreme space savings through ultra-thin, flexible multilayers.
- Integration into the smallest installation spaces, ideal for medical technology or wearables.
- Flexible adaptation to complex housing geometries.
Full-Service: Assembly & Quality Assurance
Following structuring, we handle the final completion:
- Assembly & Packaging: Professional assembly and housing technology under cleanroom conditions.
- Burn-In & Test: Ensuring long-term reliability through qualified testing procedures and stress tests.
Take your technology to the next level with our specialized manufacturing services.
